Laser prototyping of multilayer LTCC microwave components for system-in-package applications
Author:
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://digital-library.theiet.org/content/journals/10.1049/iet-map.2010.0352?crawler=true&mimetype=application/pdf
Reference29 articles.
1. A Wireless Embedded Resonant Pressure Sensor Fabricated in the Standard LTCC Technology
2. Hot Plate Gas Sensors-Are Ceramics Better?
3. Miniature pressure sensor and micromachined actuator structure based on low-temperature-cofired ceramics and piezoelectric material
4. Fabrication of Precise Fluidic Structures in LTCC
5. Optical-fluidic Sensors in LTCC- technology
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4. Surfing the Millimeter-Wave: Multilayer Photoimageable Technology for High Performance SoP Components in Systems at Millimeter-Wave and Beyond;IEEE Microwave Magazine;2016-01
5. A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages;International Journal of Antennas and Propagation;2016
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