Inductor‐less envelope modulated radio frequency power amplifier using stacked amplifiers and envelope shaping-Reference-Cited by-同舟云学术

Inductor‐less envelope modulated radio frequency power amplifier using stacked amplifiers and envelope shaping

Published:2013-12 Issue:15 Volume:7 Page:1215-1220
ISSN:1751-8733
Container-title:IET Microwaves, Antennas & Propagation
language:en
Short-container-title:IET Microwaves, Antennas & Propagation

Author:

Watkins Gavin¹

Affiliation:

1. Toshiba Research Europe Limited32 Queen SquareBristolBS1 4NDUK

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/iet-map.2013.0328

Reference19 articles.

1. 3GPP LTE Homepage available athttp://www.3gpp.org/article/lte 22 January 2011

2. RFPA2026 datasheet available athttp://www.RFMD.com 9 April 2013

3. Watkins G. Zhou J. Morris K.: ‘> 41% efficient 10 W envelope modulated LTE downlink power amplifier’.2011 European Microwave Integrated Circuits Conference (EuMIC) 10–11 October2011 pp.260–263

4. Watkins G.T.: ‘Wideband class B amplifiers for split frequency envelope modulated RF power amplifiers’.2013 Spring ARMMS Conf. 2013

5. A Class-G Supply Modulator and Class-E PA in 130 nm CMOS

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