System‐level SPICE model for predicting the effects of external incident EMI on a shielded communication system with an antenna
Author:
Affiliation:
1. Department of Electronic EngineeringTsinghua UniversityRohm Building of Tsinghua UniversityHaidian DistrictBeijingPeople's Republic of China
Funder
National Natural Science Foundation of China
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/iet-map.2016.0410
Reference20 articles.
1. Susceptibility of Electronic Systems to High-Power Microwaves: Summary of Test Experience
2. A Systematic Coupled Approach for Electromagnetic Susceptibility Analysis of a Shielded Device With Multilayer Circuitry
3. Fast and Rigorous Analysis of EMC/EMI Phenomena on Electrically Large and Complex Cable-Loaded Structures
4. High‐power EMI on RF amplifier and digital modulation schemes;Bayram Y.;IEEE Trans. Electromagn. Compat.,2008
5. Hybrid analysis of electromagnetic interference effects on microwave active circuits within cavity enclosures;Yang T.;IEEE Trans. Electromagn. Compat.,2010
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