Towards IP integration on SoC: a case study of high‐throughput and low‐cost wrapper design on a novel IBUS architecture-Reference-Cited by-同舟云学术

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Towards IP integration on SoC: a case study of high‐throughput and low‐cost wrapper design on a novel IBUS architecture

Published:2020-09-18 Issue:6 Volume:14 Page:353-362
ISSN:1751-8601
Container-title:IET Computers & Digital Techniques
language:en
Short-container-title:IET Computers & Digital Techniques

Author:

Yang Xiaokun¹,Sha Shi²,Unwala Ishaq¹,Lu Jiang¹

Affiliation:

1. Engineering DepartmentUniversity of Houston Clear LakeHoustonTX77058USA

2. Department of Electrical EngineeringWilkes UniversityWilkes‐BarrePA18766USA

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/iet-cdt.2019.0090

Reference27 articles.

1. AMBA AHB Specification.Axis Sunnyvale CA USA 1999

2. AMBA AXI Protocol Specification.Axis Sunnyvale CA USA 2003

3. Wishbone BUS.Silicore Corp. Corcoran MN USA 2003

4. Open Core Protocol Specification.OCP Int. Partnership Beaverton OR USA 2001

5. Advanced Encryption Standard (AES) FIPS‐197 National Institute of Standards and Technology November2001

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Edge Detection IP of Low-Cost System on Chip for Autonomous Vehicles;Transactions on Computational Science and Computational Intelligence;2021

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