Phone‐nomenon 2.0: A compact thermal model for smartphones-Reference-Cited by-同舟云学术

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Phone‐nomenon 2.0: A compact thermal model for smartphones

Published:2023-01-08 Issue:2 Volume:17 Page:43-59
ISSN:1751-8601
Container-title:IET Computers & Digital Techniques
language:en
Short-container-title:IET Computers & Digital Tech

Author:

Lee Yu‐Min¹,Chiou Hong‐Wen²^ORCID,Shiau Shinyu³,Pan Chi‐Wen²,Ting Shih‐Hung²

Affiliation:

1. Department of Electronics and Electrical Engineering National Yang Ming Chiao Tung University Hsinchu Taiwan

2. Institute of Communications Engineering National Yang Ming Chiao Tung University Hsinchu Taiwan

3. Electrical and Computer Engineering Carnegie Mellon University Pittsburgh Pennsylvania USA

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/cdt2.12052

Reference45 articles.

1. Sekar K.:Power and thermal challenges in mobile devices. In:International Conference on Mobile Computing and Networking pp.363–368(2013)

2. Paterna F. Zanotelli J. Rosing T.S.:Ambient variation‐tolerant and inter components aware thermal management for mobile system on chips. In:Design Automation and Test in Europe Conference pp.1–6(2014)

3. Nowroz A.N. Cochran R. Reda S.:Thermal monitoring of real processors: techniques for sensor allocation and full characterization. In:Design Automation Conference pp.56–61(2010)

4. Biber C.:Sensor placement for surface temperature control in thin mobile form factors. In:Thermal Measurement Modeling and Management Symposium pp.31–36(2015)

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