Fabrication and measurement of 3D LPF based on coaxial TSV-Reference-Cited by-同舟云学术

Fabrication and measurement of 3D LPF based on coaxial TSV

Published:2019-01 Issue:2 Volume:55 Page:102-103
ISSN:0013-5194
Container-title:Electronics Letters
language:en
Short-container-title:Electron. lett.

Author:

Wang Fengjuan¹,Li He²,Yu Ningmei¹

Affiliation:

1. School of Automation and Information EngineeringXi'an University of TechnologyXi'an710048People's Republic of China

2. Department of Computer Application and Simulation TechnologyThe Second Institute of China Aerospace Science & Industry CorpBeijing100854People's Republic of China

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/el.2018.7325

Reference12 articles.

1. Metal Proportion Optimization of Annular Through-Silicon via Considering Temperature and Keep-Out Zone

2. Electrical modeling and characterization of silicon‐core coaxial through‐silicon vias in 3‐D integration;Qian L.;Trans. Compon. Packag. Manuf. Technol.,2018

3. Effectiveness of p + layer in mitigating substrate noise induced by through‐silicon via for microwave applications;Yin X.;Microw. Wirel. Compon. Lett.,2016

4. A model of air‐gap through‐silicon vias (TSVs) for microwave applications;Liu X.;Microw. Wirel. Compon. Lett.,2015

5. Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias

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1. 3-D Compact Marchand Balun Design Based on Through-Silicon via Technology for Monolithic and 3-D Integration;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2022-08

2. A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line;IEICE Electronics Express;2022-02-10

3. Design of compact LC lowpass filters based on coaxial through-silicon vias array;Microelectronics Journal;2021-10

4. Compact Bandpass Filter and Diplexer With Wide-Stopband Suppression Based on Balanced Substrate-Integrated Waveguide;IEEE Transactions on Microwave Theory and Techniques;2021-01

5. Balanced SIW BPF based on Through-Glass Vias;2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT);2020-09-20