Quantitative relationship between crystallite size and adhesion strength of the electroforming layer during microelectroforming process-Reference-Cited by-同舟云学术

Quantitative relationship between crystallite size and adhesion strength of the electroforming layer during microelectroforming process

Published:2015-02 Issue:2 Volume:10 Page:64-66
ISSN:1750-0443
Container-title:Micro & Nano Letters
language:en
Short-container-title:Micro & Nano Letters

Author:

Zhao Zhong¹,Du Liqun¹²

Affiliation:

1. Key Laboratory for Precision and Non‐traditional Machining Technology of Ministry of EducationDalian University of TechnologyDalian116024People's Republic of China

2. Key Laboratory for Micro/Nano Technology and Systems of Liaoning ProvinceDalian University of TechnologyDalian116024People's Republic of China

Funder

National Natural Science Foundation of China

Publisher

Institution of Engineering and Technology (IET)

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/mnl.2014.0430

Reference17 articles.

1. Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films

2. Analysis of effecting factors for adhesion of chromium plating coating on aluminum;Wu X.Q.;Mater. Prot.,2001

3. An overview of the potential of quantitative coating adhesion measurement by scratch testing

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Structural, morphological, compositional and optical properties of CoS2 thin films synthesized by adsorption-diffusion method;Current Applied Physics;2024-12

2. Structural, Morphological, Compositional and Optical Properties of Cos2 Thin Films Synthesized by Adsorption-Diffusion Method;2023

3. Chemical bond formed between electrodeposits and substrate at room temperature with a novel in situ electrochemical treatment;Materials Today Communications;2022-12

4. Impact of surface morphology and thickness of tin selenide thin films on their optical properties;Surfaces and Interfaces;2022-02

5. A new ultrasonic electrochemical potential activation method to enhance the adhesion strength between electroforming layer and Cu substrate;Journal of Adhesion Science and Technology;2021-01-11