Ultra-compact high transmittance photonic wire bends for monolithic integration on III/V-semiconductors-Reference-Cited by-同舟云学术

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Ultra-compact high transmittance photonic wire bends for monolithic integration on III/V-semiconductors

Published:2006 Issue:22 Volume:42 Page:1280
ISSN:0013-5194
Container-title:Electronics Letters
language:en
Short-container-title:Electron. Lett.

Author:

Schuller Ch.,Höfling S.,Forchel A.,Etrich C.,Iliew R.,Lederer F.,Pertsch T.,Reithmaier J.P.

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Link

https://digital-library.theiet.org/content/journals/10.1049/el_20062195?crawler=true&mimetype=application/pdf

Reference8 articles.

1. Low-Loss SOI Photonic Wires and Ring Resonators Fabricated With Deep UV Lithography

2. Efficient light transmission through InP-based photonic crystal waveguides

3. Photonic-crystal ultrashort bends with improved transmission and low reflection at 1.55 μm

4. A study of high-index-contrast 90 degree waveguide bend structures

5. Losses in single-mode silicon-on-insulator strip waveguides and bends

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Highly efficient and compact photonic wire splitters on GaAs;Applied Physics Letters;2007-11-26

2. Nanostructured Semiconductor Materials For Optoelectronic Applications;Nanostructured Materials for Advanced Technological Applications

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