Compact flip‐chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver
Author:
Affiliation:
1. NTT Photonics LaboratoriesNTT Corporation3‐1 Morinosato‐WakamiyaAtsugiKanagawa243‐0198Japan
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/el.2013.4276
Reference9 articles.
1. http://www.ieee802.org/3/400GSG/
2. 50‐Gb/s direct modulation of a 1.3‐μm InGaAlAs‐based DFB laser with a ridge waveguide structure;Kobayashi W.;IEEE J. Sel. Top. Quantum Electron.,2013
3. 50-Gbps Direct Modulation using 1.3-μm AlGaInAs MQW Distribute-Reflector Lasers
4. 50 Gbit/s uncooled operation (5–85°C) of 1.3 μm electroabsorption modulator integrated with DFB laser;Fujisawa T.;Electron. Lett.,2013
5. 1.3 μm, 56-Gbit/s EML Module target to 400GbE
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