Comparison of Al and TiPtAu metallisations on a GaAs MESFET with GeMoW ohmic contacts
Author:
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://digital-library.theiet.org/content/journals/10.1049/el_19930675?crawler=true&mimetype=application/pdf
Reference5 articles.
1. Murakami, M., Shih, Y.C., Price, W.H., Braslau, N., Childs, K.D., and Parks, C.C.: ‘Thermally stable, low resistance ohmic contacts to n-type GaAs’, GaAs and related compounds 1987, (IOP Publishing Ltd., Bristol, England 1988), p. 55–60
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Electrical and Structural Properties of Refractory Metal Multilayer Au/Ti/W/Ti Ohmic Contacts to n-GaAs;Japanese Journal of Applied Physics;2003-05-15
2. Improved higfet using Ti/Pt/Au ohmic contacts to beryllium implanted GaAsSb;Solid-State Electronics;1996-02
3. Electrical and structural properties of GeMoW ohmic contact to an In0.5Ga0.5As cap layer on n-Type GaAs;Journal of Electronic Materials;1994-09
4. Thermally stable WTiAu non-alloyed ohmic contacts on In0.5Ga0.5As for GaAsAlGaAs heterojunction bipolar transistor applications;Materials Science and Engineering: B;1994-07
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