10 Gbit/s 1.3 [micro sign]m DFB-LD module in 0.5 cc ceramic package for LAN/MAN applications
Author:
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://digital-library.theiet.org/content/journals/10.1049/el_20010224?crawler=true&mimetype=application/pdf
Reference7 articles.
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Directly Modulated Semiconductor Lasers;IEEE Journal of Selected Topics in Quantum Electronics;2018-01
2. Low-cost and highly manufacturable 10Gb/s mini-flat transmitter for ethernet applications;SPIE Proceedings;2005-01-31
3. Microwave packaging of high - speed semiconductor lasers;Integrated Photonics Research and Applications/Nanophotonics for Information Systems;2005
4. Low-cost high-manufacturability and thermal stability optical front-end for 10-Gb ethernet applications;Materials, Active Devices, and Optical Amplifiers;2004-05-12
5. 1.3-<tex>$mu$</tex>m Uncooled DFB Laser-Diode Module With a Coupled Differential Feed for 10-Gb/s Ethernet Applications;Journal of Lightwave Technology;2004-02
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