Numerical study of chip cooling with internal nanofluid in minichannels and external air flow over sink with laminar regimes-Reference-Cited by-同舟云学术

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Numerical study of chip cooling with internal nanofluid in minichannels and external air flow over sink with laminar regimes

Published:2018-08 Issue:8 Volume:13 Page:1105-1110
ISSN:1750-0443
Container-title:Micro & Nano Letters
language:en
Short-container-title:Micro & Nano Letters

Author:

Esmaeilzadeh Kandjani Negar¹,Nurelahi Shahriyar²,Tafrishi Seyed Amir³,Esmaeilzadeh Esmaeil¹⁴^ORCID

Affiliation:

1. Mechanical Engineering DepartmentUniversity of TabrizTabrizIran

2. Mechanical Engineering DepartmentUniversity College of Nabi AkramTabrizIran

3. Control Engineering Lab.Mechanical Engineering DepartmentKyushu UniversityKyushuJapan

4. Mechanical Engineering DepartmentIslamic Azad UniversityTabriz BranchTabrizIran

Publisher

Institution of Engineering and Technology (IET)

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/mnl.2018.0036

Reference27 articles.

1. Experimental Investigation of the Thermal Performance of Piezoelectric Fans

2. GlezerA.MahalingamR.AllenM.G.: ‘System and method for thermal management by synthetic jet ejector channel cooling techniques’. Google Patents 2003

3. High-performance heat sinking for VLSI

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High thermal conductivity and remarkable damping composite gels as thermal interface materials for heat dissipation of chip;Chip;2022-06

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