Electrical stress mapping in a Type II machine supplied by inverters using Si and SiC‐based components-Reference-Cited by-同舟云学术

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Electrical stress mapping in a Type II machine supplied by inverters using Si and SiC‐based components

Published:2020-04-14 Issue:6 Volume:14 Page:981-990
ISSN:1751-8660
Container-title:IET Electric Power Applications
language:en
Short-container-title:IET Electric Power Applications

Author:

Acheen Robin¹²³,Abadie Cédric¹,Lebey Thierry²,Duchesne Stéphane³

Affiliation:

1. IRT Saint‐ExupéryBâtiment B612, 3 rue Tarfaya31405Toulouse CEDEX 4France

2. Safran Tech, Electrical & Electronic Systems Research GroupRue des Jeunes Bois, Châteaufort78114Magny‐Les‐HameauxFrance

3. LSEE, Université d'ArtoisFaculté des Sciences AppliquéesTechnoparc Futura62400BéthuneFrance

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/iet-epa.2019.0345

Reference19 articles.

1. A novel method to diagnose PWM-fed induction motors

2. Impact of SiC semiconductors switching transition speed on insulation health state monitoring of traction machines

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mutual Impacts of Different Dead-times and Control Sample Times on SiC Inverter Loss in Experimental Motor Drive at High Carrier Frequencies;2024 Tenth International Conference on Communications and Electronics (ICCE);2024-07-31

2. Improved Modelling of PDIV Evolution Over Time Under Multiple Ageing Factors for Insulation of Inverter-Fed Electrical Machines;IEEE Transactions on Industry Applications;2023-09

3. Novel Auto-Tuning PD-Fuzzy Control of Current Harmonics to Reduce Losses in Motor Drive Systems Excited by SiC-MOSFET Inverter;2023 SICE International Symposium on Control Systems (SICE ISCS);2023-03-09

4. Modelling of PDIV evolution over time under multiple ageing factors for insulation of inverter-fed electrical machines;2022 IEEE Industry Applications Society Annual Meeting (IAS);2022-10-09

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