Electronic‐photonic board as an integration platform for Tb/s multi‐chip optical communication
Author:
Affiliation:
1. Vario‐optics AG Heiden Switzerland
2. IDLab imec ‐ Ghent University Ghent Belgium
3. Amphenol Active Optics Products / FCI Berlin Germany
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/ote2.12017
Reference18 articles.
1. Optics in Computing: From Photonic Network-on-Chip to Chip-to-Chip Interconnects and Disintegrated Architectures
2. Kanellos G.T. Pleros N.:WDM mid‐board optics for chip‐to‐chip wavelength routing interconnects in the H2020 ICT‐STREAMS. In:Proceedings of the SPIE 10109 Optical Interconnects XVII 101090D San Francisco (2017)
3. Lamprecht T. et al.:EOCB‐platform for integrated photonic chips direct‐on‐board assembly within Tb/s applications. In:IEEE 68th Electronic Components and Technology Conference (ECTC) San Diego pp.854–858(2018)
4. Technologies for exascale systems
5. Kash J.A. et al.:Communication technologies for exascale systems. In:Proceedings of the Photonics Packaging Integration and Interconnects IX San Jose vol.7221 72210F(2009)
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