Silicon circuits for chip‐to‐chip communications in multi‐socket server board interconnects-Reference-Cited by-同舟云学术

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Silicon circuits for chip‐to‐chip communications in multi‐socket server board interconnects

Published:2021-03-22 Issue:2 Volume:15 Page:102-110
ISSN:1751-8768
Container-title:IET Optoelectronics
language:en
Short-container-title:IET Optoelectronics

Author:

Moralis‐Pegios Miltiadis¹^ORCID,Pitris Stelios¹^ORCID,Mitsolidou Charoula¹,Fotiadis Konstantinos¹,Ramon Hannes²^ORCID,Lambrecht Joris²,Bauwelinck Johan²,Yin Xin²^ORCID,Ban Yoojin³,De Heyn Peter³,Van Campenhout Joris³,Lamprecht Tobias⁴,Lehnman Andreas⁵,Pleros Nikos¹,Alexoudi Theoni¹

Affiliation:

1. Department of Informatics Aristotle University of Thessaloniki Thessaloniki Greece

2. IDLab Department of Information Technology Ghent University IMEC Ghent Belgium

3. IMEC Leuven Belgium

4. Vario‐optics AG Heiden Switzerland

5. Amphenol FCI Berlin Germany

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/ote2.12018

Reference26 articles.

1. A 1024-Port Optical Uni- and Multicast Packet Switch Fabric

2. High-port low-latency optical switch architecture with optical feed-forward buffering for 256-node disaggregated data centers

3. Optics in Computing: From Photonic Network-on-Chip to Chip-to-Chip Interconnects and Disintegrated Architectures

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. RAMP: A flat nanosecond optical network and MPI operations for distributed deep learning systems;Optical Switching and Networking;2024-02

2. AMPeD: An Analytical Model for Performance in Distributed Training of Transformers;2023 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS);2023-04

3. Temperature and wavelength drift tolerant WDM transmission and routing in on-chip silicon photonic interconnects;Optics Express;2022-07-08

4. Chip-to-chip optical interconnect using direct optical wire bonding;Optical Interconnects XXII;2022-03-05

5. Direct optical wire bonding through open-to-air polymerization for silicon photonic chips;Optics Letters;2022-01-31

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