Temperature distribution on ceramic substrates
Author:
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://digital-library.theiet.org/content/journals/10.1049/el_19860302?crawler=true&mimetype=application/pdf
Reference3 articles.
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A survey of the thermal stability of an active heat sink;Microelectronics Reliability;1997-12
2. Experimental verification of the temperature distribution on ceramic substrates;Journal of Physics D: Applied Physics;1994-10-14
3. A Reduction of a Thermal Model of Power Hybrid Circuits;Microelectronics International;1994-01-01
4. Temperature Computations in Power Microcircuits;Microelectronics International;1993-02
5. Accuracy of Temperature Computation in Hybrid Microelectronics;Microelectronics International;1992-01
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