Capacitive micromachined ultrasonic transducer arrays incorporating anodically bondable low temperature co‐fired ceramic for small diameter ultrasonic endoscope-Reference-Cited by-同舟云学术

Capacitive micromachined ultrasonic transducer arrays incorporating anodically bondable low temperature co‐fired ceramic for small diameter ultrasonic endoscope

Published:2016-10 Issue:10 Volume:11 Page:627-631
ISSN:1750-0443
Container-title:Micro & Nano Letters
language:en
Short-container-title:Micro & Nano Letters

Author:

Yildiz Fikret¹,Matsunaga Tadao²,Haga Yoichi¹³

Affiliation:

1. Graduate School of EngineeringTohoku UniversitySendai980‐8579Japan

2. Micro System Integration Center (μSIC)Tohoku UniversitySendai980‐8577Japan

3. Graduate School of Biomedical EngineeringTohoku UniversitySendai980‐8579Japan

Publisher

Institution of Engineering and Technology (IET)

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/mnl.2016.0281

Reference20 articles.

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3. Wafer‐bonded 2‐D CMUT arrays incorporating through‐wafer trench‐isolated interconnects with a supporting frame;Zhuang X.;IEEE Trans. Ultrason. Ferroelectr. Freq. Control,2009

4. ZhuangX.ErgunA.S.OralkanO.et al.: ‘Interconnection and packaging for 2D capacitive micromachined ultrasonic transducer arrays based on through‐wafer trench isolation’.19th IEEE Int. Conf. on Micro Electro Mechanical Systems Istanbul Turkey 2006

5. ChengC.H.ErgunA.S.Khuri‐YakubB.T.: ‘Electrical through wafer interconnects with sub‐Pico Farad parasitic capacitance’.Proc. IEEE Microelectromechanical Systems Conf. 2001

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