Latched microswitches in laminates for high power 0–6.5 GHz applications
Author:
Affiliation:
1. Department of Electrical EngineeringUniversity of CaliforniaIrvineCA92697USA
2. California Institute for Telecommunications and Information TechnologyUniversity of CaliforniaIrvineCAUSA
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/el.2014.1709
Reference11 articles.
1. Three‐dimensional RF MEMS switch for power applications;Choi J.;IEEE Trans. Ind. Electron.,2009
2. RF MEMS
3. High-Power Magnetically Actuated Microswitches Fabricated in Laminates
4. Bachman M. Li G.P.:‘Methods of manufacturing microdevices in laminates lead frames packages and printed circuit boards’. USPTO June 2005
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