Abstract
Thermal management for white LEDs at the encapsulant level is an important task to ensure that the device can operate at a high optical and color performance. In this study, a steady-state thermal model was built wherein the finite element method was employed using MATLAB software to identify the temperature distribution. The spatial temperature distribution of the encapsulant and blue LED die region was easily simulated and predicted. The obtained results are not only helpful in detecting the temperature behavior inside the packaging volume but also meaningful for designing the package configuration. Full Text: PDF References
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Publisher
Photonics Society of Poland