Laser Deprocessing Technique and its Application to Physical Failure Analysis
Author:
Publisher
ASTES Journal
Subject
Management of Technology and Innovation,Physics and Astronomy (miscellaneous),Engineering (miscellaneous)
Link
https://www.astesj.com/publications/ASTESJ_0505153.pdf
Reference9 articles.
1. H. H. Yap, P. K. Tan, L. Zhu, H. Feng, Y. Z. Zhao, R. He, H. Tan, B. H. Liu, Y. M. Huang, D. D. Wang, J. Lam, Z. H. Mai, "Application of Laser Deprocessing Technique in PFA on Chemical Over-etched on Bond-pad Issue," Microelectronics Reliability, 64, 357-361, 2016, doi:10.1016/j.microrel.2016.07.057.
2. S. Ikeda, Y. Yoshida, K. Ishibashi, Y. mitsui, "Failure Analysis of 6T SRAM on Low-voltage and High-frequency Operation," in 2003 IEEE Transactions on Electron Devices, 1270-1276, 2019, doi:10.1109/TED.2003.813474.
3. Z. G. Song, "SRAM Failure Analysis Evolution Driven by Technology Scaling," in 2014 IEEE International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA), 2014, doi:10.1109/IPFA.2014.6898207.
4. P. Egger, C. Burmer, "SRAM Failure Analysis Strategy," in 2003 International Symposium for Testing and Failure Analysis (ISTFA), 177-183, 2003.
5. C. Q. Chen, P. T. Ng, S. P. Neo, P. K. Tan, A. C. T. Quah, J. Zhu, "Application of Nanoprobing on Subtle Defects in the Embedded Non-volatile Memory Device," in 2019 International Symposium for Testing and Failure Analysis (ISTFA), 2019.
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