1. Science and engineering beyond Moore's law;R K Cavin;SPL CONTENT,2012
2. wafer-to-wafer alignment for three-dimensional integration: A review;S H Lee;J. Microelectromechanical Syst,2011
3. Low-loss through Silicon Vias (TSVs) and transmission lines for 3D optoelectronic integration;S Wang;Microelectron. Eng,2020
4. 3D stacking of chips with electrical and microfluidic I/O interconnects;C R King;Proceedings -Electronic Components and Technology Conference,2008
5. Electrical and fluidic C4 interconnections for inter-layer liquid cooling of 3D ICs;C R King;Proceedings -Electronic Components and Technology Conference,2010