Author:
Yoon Jeong-Won,Lee Dong-Hwan,Jeong Min-Seong
Cited by
1 articles.
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1. Effects of Multiple Reflows on IMC and Shear Strength of Individual Solder Joints;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30