Investigation of the Cutting Force and Material Removal Mechanism in Ultrasonic Vibration-Assisted Scratching of 2d-Sicf/Sic Composites

Author:

Lin Hao,Zhou Ming,wang haotao,Bai Sutong

Publisher

Elsevier BV

Reference35 articles.

1. Effects of grinding speed on the material removal mechanism in single grain grinding of SiCf/SiC ceramic matrix composite[J];Yin Jingfei;Ceramics International,2021

2. Some observations in grinding SiC and silicon carbide ceramic matrix composite material[J];Yadong Gong;The International Journal of Advanced Manufacturing Technology,2019

3. Effect of fiber orientation on microscopic surface characteristics of surface grinding of unidirectional C/SiC composites;L Zhang;Materialwissenschaft und Werkstofftechnik,2019

4. Application and prospect of ceramic matrix composite components for a commercial aircraft engine;Gao;Aeronautical Manufacturing Technology,2014

5. Cutting path-dependent machinability of SiCp/Al composite under multi-step ultra-precision diamond cutting[J];L U Shijin;Chinese Journal of Aeronautics,2021

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