1. Experimental and numerical study on thermal performance of wood's alloy/expanded graphite composite phase change material for temperature control of electronic devices;Z Huang;International Journal of Thermal Sciences,2019
2. Heat dissipation optimization and prediction for three-dimensional fan-out package;J Huang;International Journal of Thermal Sciences,2021
3. Evaluation technique for the failure life scatter of lead-free solder joints in electronic device;H Miyauchi;13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC),2007
4. Thermal deformation analysis of automotive electronic control units subjected to passive and active thermal conditions;B Wu;16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,2015