Author:
Martin Henry Antony,Libon Sebastien,Smits Edsger,Poelma Rene,van Driel Willem D.,Zhang Guoqi
Reference33 articles.
1. Thermal characterization of highly conductive die attach materials;M A Ras;20th International Workshop on Thermal Investigations of ICs and Systems,2014
2. Characterization of die-attach thermal interface of high-power light-emitting diodes: An inverse approach;D.-S Kim;IEEE Transactions on Components, Packaging and Manufacturing Technology,2015
3. Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance;X Cao;IEEE Transactions on Components, Packaging and Manufacturing Technology,2011
4. Two-dimensional mapping of interface thermal resistance by transient thermal measurement;S Gao;IEEE Transactions on Industrial Electronics,2021