Bevel Contamination Management in 3d Integration by Localized Sio2 Deposition

Author:

Boulard François,Gros Vincent,Porzier Christophe,Brunet Laurent,Lapras Valérie,Fournel Frank,Truffier-Boutry Delphine,Autillo Delphine,Ruault Patrick,Keovisai Moty,Posseme Nicolas

Publisher

Elsevier BV

Subject

General Earth and Planetary Sciences,General Environmental Science

Reference16 articles.

1. First demonstration of a CMOS over CMOS 3D VLSI CoolCube� integration on 300mm wafers;L Brunet;Digest of Technical Papers -Symposium on VLSI Technology,2016

2. A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit;F Andrieu;International Conference on IC Design & Technology (ICICDT),2018

3. Area and Cost Analysis of the Mixed Signal Circuits in a Novel Monolithic 3D Process;B S Rikan;Midwest Symposium on Circuits and Systems,2021

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3