Interfacial Endogenous Stress-Induced Phase-Stress Partition in Tin-Lead Dual-Phase Alloy at Cryogenic Temperature

Author:

An Qi,An Rong,Wang Chunqing

Publisher

Elsevier BV

Subject

General Earth and Planetary Sciences,General Environmental Science

Reference30 articles.

1. Tin-lead (Sn-Pb) solder reaction in flip chip technology;K N Tu;Materials Science and Engineering: R: Reports,2001

2. Effect of stress and strain state on heterogeneous coarsening in Sn-Pb solder;M W Woodmansee;Acta Materialia,2006

3. Deformation induced phase rearrangement in near eutectic tinlead alloy;K C R Abell;Acta Materialia,2002

4. Lead-free solders in microelectronics;M Abtew;Materials Science and Engineering: R: Reports,2000

5. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;K Zeng;Materials Science and Engineering: R: Reports,2002

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