1. IR-Drop Modelling and Reduction for HighPerformance Printed Circuit Boards;Mu-Shui Zhang;IEEE Electromagnetic Compatibility Magazine,2015
2. Power Integrity Design for Package-Board System Based on BGA;Sun Haiyan;18 th International Conference on Electronic Packaging Technology,2017
3. Power Distribution Networks for Systems-on-package status and challenges;M Swaminathan;IEEE Trans. Adv., Packag,2004
4. Signal/power integrity modeling of high-speed memory modules using chip-package-board coanalysis;H.-H Chuang;IEEE Trans
5. Contents of other Volumes