Inductively Coupled Plasma Etching of Bulk Tungsten for Mems Applications

Author:

Xia Yanming,Wang Zetian,Song Lu,Wang Wei,Chen Jing,Ma Shenglin

Publisher

Elsevier BV

Subject

General Earth and Planetary Sciences,General Environmental Science

Reference39 articles.

1. Porous tungsten machining under cryogenic conditions;F Pusavec;International Journal of Refractory Metals and Hard Materials,2012

2. Morphological and spectroscopic characterization of laser-ablated tungsten at various laser irradiances;M Akram;Appl Phys A,2015

3. Fabrication and characterization of a tungsten microneedle array based on deep reactive ion etching technology;S Ma;J Vac Sci Technol, B,2016

4. Development of Minimally Invasive Microneedle Made of Tungsten -Sharpening Through Electrochemical Etching and Hole Processing for Drawing up Liquid Using Excimer Laser;T Tanaka;J Robot Mechatron,2013

5. Development of novel tungsten processing technologies for electrochemical machining (ECM) of plasma facing components;N Holstein;Fusion Eng Des,2011

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