1. Study on the film forming mechanism, corrosion inhibition effect and synergistic action of two different inhibitors on copper surface chemical mechanical polishing for GLSI;K Zhou;Appl. Surf. Sci,2020
2. An optimized passivation mechanism at the copper film recess for achieving efficient planarization of copper chemical mechanical polishing;N Y Zeng;Mater. Sci. Semicond. Process,2022
3. Unraveling the surface behavior of amino acids on Cu wiring in chemical mechanical polishing of barrier layers: A combination of experiments and ReaxFF MD;T D Ma;J. Mol. Liq,2021
4. Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: combination of simulation and experiment;T Ma;Colloids Surf., A,2020
5. Electrochemical, theoretical and surface physicochemical studies of the alkaline copper corrosion inhibition by newly synthesized molecular complexes of benzenediamine and tetraamine with ? acceptor;M M Ibrahim;J. Mol. Liq,2020