Author:
Zhang Xinyuan,Ren Fujie,Wang Chengduo,Li Qingkui,Sun Benshuang,He Jilin
Reference29 articles.
1. Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor-liquid crystal display applications;Y W Yen;Thin Solid Films,2007
2. Evident thickness effect on structure and mechanical properties of molybdenum films;K Hu;Thin Solid Films,2023
3. First-principles investigation on the effects of alloying elements on Cu/Mo interface;Z Li;Chem. Phys. Lett,2023
4. Effect of nitric acid on wet etching behavior of Cu/Mo for TFT application;B Seo;Curr. Appl. Phys,2011