Comparative Study of Intrachain Versus Interchain Cross-Linking on the Mechanical, Thermal and Dielectric Properties of Low-K Polyimide

Author:

Zhao Wanjing,Tong Yizhang,Zeng Peipei,Zhou Yangsheng,Cao Xianwu,Wu Wei

Publisher

Elsevier BV

Reference45 articles.

1. Novel high-performance poly(benzoxazoleco-imide) resins with low dielectric constants and superior thermal stabilities derived from thermal rearrangement of ortho-hydroxy polyimide oligomers;X Li;Chem. Eng. J,2019

2. Fluorographene/polyimide composite films: Mechanical, electrical, hydrophobic, thermal and low dielectric properties;P Zhang;Compos. Part A Appl. Sci. Manuf,2016

3. Polyimide dielectrics with cross-linked structure for high-temperature film capacitors;Z Wu;Mater. Today Energy,2023

4. Preparation and characterization of organic soluble polyimides with low dielectric constant containing trifluoromethyl for optoelectronic application;K Hu;Eur. Polym. J,2021

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