Preparation of Ag-Cu Nanoparticle Film Using a Dual-Beam Pulsed Laser Deposition for Power Electronic Packaging-Reference-Cited by-同舟云学术

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Preparation of Ag-Cu Nanoparticle Film Using a Dual-Beam Pulsed Laser Deposition for Power Electronic Packaging

Published:2023 Issue: Volume: Page:
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Author:

Zhou Bolong,Jia Qiang,Wang Yishu,Li Dan,Zhang Hongqiang,Hu Huan,Ma Limin,Zou Guisheng,Guo Fu

Publisher

Elsevier BV

Reference32 articles.

1. Effect of Size on the Formation of Solid Solutions in Ag-Cu Nanoparticles [J];S I Bogatyrenko;The Journal of Physical Chemistry C,2023

2. Preparation of Oxidation-Resistant Ag-Cu Alloy Nanoparticles by Polyol Method for Electronic Packaging;J F Yan;Journal of Electronic Materials,2019

3. Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging [J];K S Siow;Journal of Electronic Materials,2014

4. Supersaturated Ag-Cu nanoalloy film for high reliability power electronic packaging [J];Q Jia;Applied Surface Science,2023

5. Novel SiC-based power device bonding materials of nano foam sheet and its characteristic and properties[J];H Z Zhang;IEEE Transactions on Components, Packaging and Manufacturing Technology,2023

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