1. Overview and outlook of through-silicon via (TSV) and 3D integrations;J H Lau;MICROELECTRON INT,2011
2. Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration;J H Lau;Intl. Symp. APM,2011
3. Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps;A Yu;Proc. 59st ECTC,2009
4. Three-dimensional integrated circuits for low-power, high-bandwidth systems on a chip;J Burns;IEEE ISSCC,2001
5. Development of silicon module with TSVs and global wiring;M Sunohara;Proc. 59st ECTC,2009