Thermal Internal Resistance Minimisation in Microchannel Heat Sink with Perforated Micro Fins Geometry

Author:

Godi Nahum

Publisher

Elsevier BV

Reference44 articles.

1. High-Performance Heat Sinking for VLSI;D B Tuckerman;IEEE Electron Device Lett,1981

2. Optimal Structure for micro-grooved Cooling fin for highpower Lsi Devices;S Sasaki;Electron. Lett,1986

3. Cooling Characteristics of Diamond-Shaped Interrupted Cooling Fin for High-Power LSI Devices;T Kishimoto;Electron. Lett,1987

4. Forced-Convection, Liquid-Cooled, Microchannel Heat Sinks for High-Power-Density Microelectronics;R J Phillips;Proc. Cooling Technology for Electronic Equipment, W. Aung,1987

5. Microchannel Heat Sinks and Micro lens Arrays for High Average-Power Diode Laser Arrays;J N Walpole;Proc. LEOS '88-Lasers and Electro-Optics,1988

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