A Step-By-Step Analysis of the Polishing Process for Tungsten Specimens

Abstract

Abstract The different stages of the polishing process of polycrystalline tungsten samples were investigated by scanning electron microscopy of both the sample surface and of cross-sections prepared with the help of a focused ion beam. It is shown that a distortion layer is present at the sample surface after mechanical fine grinding and even after polishing with diamond suspension, although the sample has a mirror-like finish. A sufficiently long chemo-mechanical polishing step using an alkaline colloidal silica suspension was able to remove this distortion layer. Although electropolishing produced an even smoother surface, the microstructure quality after chemo-mechanical polishing is comparable to that of an electropolished sample.