Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite
Author:
Publisher
Walter de Gruyter GmbH
Subject
Metals and Alloys
Reference21 articles.
1. Properties of copper reinforced by laser-generated Al2O3-nanoparticles
2. Microstructure and Mechanical Behavior of Cu-Based Composites Reinforced with WC and TiC Particles, Prepared by Spray Forming
3. Processing and Properties of Dense Cu Nanocomposites
4. Effect of Graphite with and Without Copper Coating on Consolidation Behaviour and Sintering of Copper–Graphite Composite
5. Electric Conductivity and Mechanical Properties of Carbide Dispersion-Strengthened Copper Prepared by Compocasting
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1. The thermal stability of Ti2AlC and Ag/Ti2AlC in Ar and air;Materials Characterization;2024-07
2. Effect of extrusion speed on properties of Cu−5vol.%Ti2SnC composite wire fabricated by friction stir back extrusion process;Transactions of Nonferrous Metals Society of China;2024-03
3. Microstructure, mechanical, electrical and wear properties of friction stir back extruded copper-6 vol.%Ti2SnC composite material;Canadian Metallurgical Quarterly;2024-01-23
4. Friction Stir Back Extrusion of Cu-5 vol.% Ti2SnC Composite;Journal of Materials Engineering and Performance;2023-09-01
5. Microstructures and properties of copper matrix composite wires reinforced with Ti2SnC particles;Materials Science and Technology;2023-09
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