Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys-Reference-Cited by-同舟云学术

Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys

Published:2019-12-10 Issue:12 Volume:110 Page:1150-1159
ISSN:2195-8556
Container-title:International Journal of Materials Research
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Author:

Raj R.¹,Shrivastava P.¹,Jindal N.¹,Alam S. N.¹,Naithani N.¹,Padhy M.¹,Phani A. S. D.¹,Ramana T. V. V.²,Abbas M. M.²

Affiliation:

1. aNational Institute of and Technology Rourkela, Rourkela, Odisha, India

2. bRajiv Gandhi University of Knowledge and Technologies, Nuzvid, Andhra Pradesh, India

Abstract

AbstractThis paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest electrical resistivity of 1.91 μΩ · cm whereas the highest electrical resistivity of 14.17 μΩ · cm was observed in the case of Sn-43 wt.% Bi eutectic solder alloy. The lowest melting point of 141.60°C was observed in the case of Sn-43 wt.% Bi eutectic alloy whereas the highest melting point of 243.28°C was observed in the case of Sn-3.5 wt.% Ag solder alloy. The results of the various solder alloys were compared with the properties of commercially available Sn-38.1 wt.% Pb eutectic solder alloy.

Publisher

Walter de Gruyter GmbH

Subject

Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics

Link

https://www.degruyter.com/document/doi/10.3139/146.111851/pdf

Reference45 articles.

1. In search of new lead-free electronic solders

2. An Assessment of the Use of Lead in Electronics Assembly

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