The effect of compressing pressure on the microstructure and properties of W-10 wt.% Cu composite

Abstract

Abstract The compressing pressure and microstructure and their relationship to mechanical and physical properties have been investigated in tungsten powder compacts infiltrated with copper. In this research, high pressure within the range of 250 to 550 MPa was used to produce high density green specimens (60–80%) by cold isostatic pressing while sintering was carried out in a hydrogen atmosphere. The tungsten skeletons were infiltrated with molten copper at 1300 °C. Scanning electron microscopy and tensile tests were conducted with due allowance for the participation of contiguity in microstructure. It was illustrated that the application of high compressing pressure has a direct influence on the tensile strength and conductivity. The measured tensile strength of prepared composites in this study was in the range of 400–640 MPa.