Warpage of Film Insert Molded Parts and Optimum Processing Conditions
Author:
Affiliation:
1. Research Institute of Advanced Materials (RIAM), Department of Materials Science and Engineering, Seoul National University, Seoul, South Korea
Abstract
Publisher
Walter de Gruyter GmbH
Subject
Materials Chemistry,Industrial and Manufacturing Engineering,Polymers and Plastics,General Chemical Engineering
Link
https://www.degruyter.com/document/doi/10.3139/217.2269/pdf
Reference26 articles.
1. Effect of Processing Conditions on Warpage of Film Insert Molded Parts;Fiber. Polym.,(2008)
2. Solidification of Thermoviscoelastic Melts. Part 11: Effects of Processing Conditions on Shrinkage and Residual Stresses;Polym. Eng. Sci.,(1995)
3. Solidification of Thermoviscoelastic Melts. Part 3: Effects of Mold Surface Temperature Differences on Warpage and Residual Stresses;Polym. Eng. Sci.,(1996)
4. Warpage Prediction of Optical Media;J. Polym. Sci. Part B: Polym. Phys.,(2003)
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