Residual Stress Behavior of Polyimide Thin Films: Effect of Precursors-Reference-Cited by-同舟云学术

Residual Stress Behavior of Polyimide Thin Films: Effect of Precursors

Published:2005 Issue:8 Volume:38 Page:615-622
ISSN:0021-9592
Container-title:JOURNAL OF CHEMICAL ENGINEERING OF JAPAN
language:en
Short-container-title:J. Chem. Eng. Japan

Author:

Yoo Dong Keun¹,Shim Sang June¹,Lee Dong Hyun¹,Kim Ji Heung¹,Lee Young Kwan¹,Kim Young Jun²,Kim Sung Woo³,Kim Dukjoon¹

Affiliation:

1. Department of Chemical Engineering, Polymer Technology Institute, Sungkyunkwan University

2. Department of Textile System Engineering, Polymer Technology Institute, Sungkyunkwan University

3. Departmentment of Chemical Engineering, Kyonggi University

Publisher

Society of Chemical Engineers, Japan

Subject

General Chemical Engineering,General Chemistry

Link

http://www.jstage.jst.go.jp/article/jcej/38/8/38_8_615/_pdf

Reference20 articles.

1. Effect of Poly(amic diethyl ester) Precursor on Residual Stress Behavior of Aromatic Polyimides

2. Coburn, J. C. and M. T. Pottiger; Polyimides: Fundamentals and Application, M. K. Ghosh and K. L. Mittal ed., pp. 207–247, Marcel Dekker, New York, U.S.A. (1996)

3. Swelling behavior of an aromatic polyimide

4. Hsiao, S. H. and C. T. Li; “Synthesis and Characterization of New Adamantane-Based Polyimides,” Macromolecules, 31, 7213–7217 (1998)

5. Simultaneous determination of the biaxial relaxation modulus and thermal expansion coefficient of rigid-rod polyimide films using a bending-beam technique

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