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2. Takahashi, R., T. Ueki, M. Ito, T. Takase and M. Sato; “Recovery of the Glass Abrasive Particulates from Used Slurry by Freezing and Thawing,” Kagaku Kogaku Ronbunshu, 39, 157–162 (2013)
3. The Planarization and CMP Technical Committee; JSPE; “Semi-conductor CMP Technical Term Dicrionary (Handoutai CMP Yougo Ziten),” pp. 76–77, Ohmsha (2008)
4. Ueki, T., R. Takahashi, T. Takase and M. Sato; “Separation Properties of Glass Abrasive Particulates from Used Slurry by Freezing and Thawing,” Kagaku Kogaku Ronbunshu, 40, 72–78 (2014)
5. Yamazaki, T., T. Doi, S. Kurokawa, O. Ohnishi, M. Uneda, Y. Umezaki, Y. Yamaguchi and S. Kishii; “CMP Characteristics and Mechanisms of Glass Substrate by Both Conventional Cerium Oxide (CeO2) Slurry and New Manganese Oxide Slurry for Replacing CeO2 Abrasive,” J. Jpn. Soc. Prec. Eng., 77, 960–965 (2011)