Effect of Titanium Cathode Surface Condition on Initial Copper Deposition during Electrolytic Fabrication of Copper Foil
Author:
Affiliation:
1. Mitsui Mining & Smelting Co., Ltd.
2. Materials Process Laboratories, Department of Chemical Engineering, Osaka Prefecture University
3. Department of Applied Chemistry, University of Okayama
Publisher
Society of Chemical Engineers, Japan
Subject
General Chemical Engineering,General Chemistry
Link
http://www.jstage.jst.go.jp/article/jcej/43/7/43_43.612/_pdf
Reference14 articles.
1. Armstrong, M. J. and R. H. Muller; “In situ Scanning Tunneling Microscopy of Copper Deposition with Benzotriazole,” Electrochem. Soc., 138, 2303–2307 (1991)
2. An in situ scanning tunneling microscopy study of the initial stages of bulk copper deposition on gold(100): the rim effect
3. Bisyo, M., T. Yamagishi and K. Aso; “Reliability Evaluation of Copper Foil” (in Japanese), J. Institute of Electronics Packaging, 10, 90–95 (1995)
4. First stages of the formation of copper electrodeposits and copper sputtered deposits on amorphous carbon and polycrystalline silver substrates
5. Nucleation and growth of Cu onto polycrystalline Pt electrode from acidic CuSO4 solution in the presence of H2SeO3
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