Affiliation:
1. Fraunhofer Research Institution for Additive Manufacturing Technologies IAPT 1 , Am Schleusengraben 14, 21029 Hamburg, Germany
2. Hamburg University of Technology, Institute for the Industrialization of Smart Materials 2 , Am Schleusengraben 14, Hamburg 21029, Germany
Abstract
Additive manufacturing of copper using laser powder bed fusion enables the production of highly complex components with excellent heat and electrical conductivity. However, the processing of copper by means of near-infrared laser radiation, which is commonly used, is challenging due to its high reflectivity. Nevertheless, it has been demonstrated that high densities and electrical conductivities can be achieved using high-power laser systems. In order to process pure copper with reliable quality with different machines, it is essential to understand the conditions at which a continuous weld track is formed. For this purpose, weld tracks with varying laser power and scan speeds were welded on a copper substrate plate with an applied powder layer. The preheating temperature of the substrate plate and the beam size were varied to test different process conditions. The melt pool depths and widths were measured, and a relationship was elaborated. Based on these results, cube samples with discrete weld tracks on top were manufactured. The melt pool depth was measured and compared with the predicted melt pool depth to investigate the transferability of the elaborated relationship from the substrate to process conditions. It was found that with rising preheating temperature and for larger beam diameters at the same peak intensity, the weld width and weld depths increase. Furthermore, continuous weld tracks formed reliably in the keyhole welding regime. A good agreement between the weld depth of weld tracks on the substrate and the elaborated relationship was revealed. However, the weld tracks were shallower than predicted.
Funder
Science, Research, Equality and Districts Authoriy of the Free and Hanseatic City of Hamburg
Publisher
Laser Institute of America
Subject
Instrumentation,Biomedical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials