In situ and layer-by-layer grain size estimation in additively manufactured metal components using femtosecond laser ultrasonics

Author:

Park Seong-Hyun12ORCID,Yi Kiyoon3ORCID,Liu Peipei13ORCID,Choi Gwanghyo4,Jhang Kyung-Young2ORCID,Sohn Hoon13ORCID

Affiliation:

1. Center for 3D Printing Nondestructive Testing, Korea Advanced Institute of Science and Technology, Daejeon 34141, South Korea

2. School of Mechanical Engineering, Hanyang University, Seoul 04763, South Korea

3. Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, South Korea

4. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, South Korea

Abstract

Directed energy deposition (DED) is an additive manufacturing technique wherein a focused thermal energy source and a coaxial powder delivery system are combined for the fabrication of metallic parts. Although rapid progress has been made in DED, the amount of research performed for in situ quality monitoring during fabrication is limited. Grain size monitoring during DED is particularly important because the grain size is directly related to the mechanical strength and stiffness of the final products. In this study, a layer-by-layer grain size estimation technique using femtosecond laser ultrasonics is developed for in situ monitoring during DED. The proposed technique employs fully noncontact and nondestructive testing for grain size estimation and uses the relationship between the laser-induced ultrasonic waves and the grain size. In addition to the in situ operation of the technique, spatial resolution in the micrometer range was achieved. The developed technique was validated using Ti-6Al-4V specimens fabricated by DED. The results of the quantitative grain sizes measured by the developed method were consistent with those measured through independent metallography conducted after the completion of DED.

Funder

National Research Foundation of Korea

Publisher

Laser Institute of America

Subject

Instrumentation,Biomedical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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