Laser-induced forward transfer as a potential alternative to pick-and-place technology when assembling semiconductor components-Reference-Cited by-同舟云学术

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Laser-induced forward transfer as a potential alternative to pick-and-place technology when assembling semiconductor components

Published:2021-11 Issue:4 Volume:33 Page:042030
ISSN:1042-346X
Container-title:Journal of Laser Applications
language:en
Short-container-title:Journal of Laser Applications

Author:

Springer Matthias¹,Düsing Jan¹,Koch Jürgen¹,Jäschke Peter¹,Kaierle Stefan¹,Overmeyer Ludger²

Affiliation:

1. Laser Zentrum Hannover e.V., Hollerithallee 8, Hanover 30419, Lower Saxony, Germany

2. Institute of Transport and Automation Technology, An der Universität 2, Garbsen 30823, Lower Saxony, Germany

Publisher

Laser Institute of America

Subject

Instrumentation,Biomedical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

https://lia.scitation.org/doi/pdf/10.2351/7.0000525

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal simulation of laser-induced forward transfer for Au donor film;Journal of Optics;2024-04-29

2. Structuring of thin films by ultrashort laser pulses;Applied Physics A;2022-12-08

3. Noncontact selective laser transfer printing and assembly of micro-sized semiconductor devices;2022 18th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA);2022-11-28

4. Transfer characteristics for laser-induced forward transfer of stainless steel particle;Optical Engineering;2022-07-01

5. Facile Modification of Flexible Electrodes via Laser Transfer;Materials;2022-03-28

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