A double-lithography and double-reflow process and application to multi-pitch multi-height mechanical flexible interconnects
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/0960-1317/27/i=2/a=025014/pdf
Reference18 articles.
1. Sea of leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI)
2. Novel packaging with rematable spring interconnect chips for MCM
3. J-Springs - innovative compliant interconnects for next-generation packaging
4. FlexConnects: A Cost-Effective Implementation of Compliant Chip-to-Substrate Interconnects
5. Platform for Temporary Testing of Hybrid Microsystems at High Frequencies
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