The limits of edge bead planarization and surface levelling in spin-coated liquid films
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1088/1361-6439/ab60be/pdf
Reference55 articles.
1. Rheological effects on the levelling dynamics of thin fluid films
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4. Planarization of Substrate Topography by Spin Coating
5. Global planarization of spun‐on thin films by reflow
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