Author:
Bechtold Tamara,Rudnyi Evgenii B,Korvink Jan G
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Cited by
33 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Model Order Reduction of a Microelectronic Package Subjected to Temperature Cycling and Vibration Test;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for automotive MOSFET applications;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
3. Model Order Reduction via Moment-Matching: A State of the Art Review;Archives of Computational Methods in Engineering;2021-06-25
4. Adaptive Interpolatory MOR by Learning the Error Estimator in the Parameter Domain;Model Reduction of Complex Dynamical Systems;2021
5. Error Estimation for the Simulation of Elastic Multibody Systems;PAMM;2018-12