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Bi-directional homogenization equivalent modeling for the prediction of thermo-mechanical properties of a multi-layered printed circuit board (PCB)

  • Published:2016-02-29 Issue:4 Volume:26 Page:045006
  • ISSN:0960-1317
  • Container-title:Journal of Micromechanics and Microengineering
  • language:
  • Short-container-title:J. Micromech. Microeng.

Author:

Joo Sung-Jun,Park Buhm,Kim Do-Hyoung,Kwak Dong-Ok,Park Junhong,Kim Hak-Sung

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Model updating for the simulation of surface strains on printed circuit boards considering parameter uncertainty;Journal of Physics: Conference Series;2024-06-01

2. Concept for a simulation-based reliability assessment at the system level of printed circuit boards;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

3. Developing Reprocessable shape memory thermosetting resins with high thermal resistance and strength through building a crosslinked network based on bismaleimide and epoxy resins;Journal of Applied Polymer Science;2023-01-30

4. Dual-function thermoelastic cloak based on coordinate transformation theory;International Journal of Heat and Mass Transfer;2022-10
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